Abstract: 3DIC enables the vertical stacking of multiple chip layers, connected by silicon through-silicon vias (TSV), ultimately resulting in significant reductions in chip area and interconnect ...
Abstract: The min-max multiple traveling salesman problem (minmax mTSP) is one of the most well-known combinatorial optimization problems (COPs). As a non-deterministic polynomial problem, the min-max ...
Researchers have successfully performed the world's first Milky Way simulation that accurately represents more than 100 billion individual stars over the course of 10 thousand years. This feat was ...
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